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  1. Kodu
  2. Tooted
  3. DRAM
  4. DDR4
  5. K4A4G085WE-BIRC

Samsung Semiconductor - K4A4G085WE-BIRC

KEY Part #: K7359578

[25355tk Laos]

    Osa number:
    K4A4G085WE-BIRC
    Tootja:
    Samsung Semiconductor
    Täpsem kirjeldus:
    4 Gb 512M x 8 2400 Mbps 1.2 V -40 ~ 95 °C 78FBGA.
    Manufacturer's standard lead time:
    Laos
    Säilitusaeg:
    Üks aasta
    Chip From:
    Hongkong
    RoHS:
    Makseviis:
    Saadetise viis:
    Perekonna kategooriad:
    KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: LPDDR3, MODULE, LPDDR4X, DDR4, HBM Flarebolt, SLC Nand, DDR3 and GDDR6 ...
    Konkurentsieelis:
    We specialize in Samsung Semiconductor K4A4G085WE-BIRC electronic components. K4A4G085WE-BIRC can be shipped within 24 hours after order. If you have any demands for K4A4G085WE-BIRC, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4A4G085WE-BIRC Toote atribuudid

    Osa number : K4A4G085WE-BIRC
    Tootja : Samsung Semiconductor
    Kirjeldus : 4 Gb 512M x 8 2400 Mbps 1.2 V -40 ~ 95 °C 78FBGA
    Sari : DDR4
    tihedus : 4 Gb
    Org. : 512M x 8
    kiirus : 2400 Mbps
    Pinge : 1.2 V
    Temp. : -40 ~ 95 °C
    pakend : 78FBGA
    toote staatus : Mass Production

    Viimased uudised

    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    5G and Memory - from Connected Thinking to Connected Living
    The future of NAND technology
    Mass Production of Fifth-Generation V-NAND has Started
    Evolving Mobile Solutions: Samsung at MWC 2018
    Samsung Electronics Starts Mass Producing Industry’s First 8-Gigabit Graphics DRAM (GDDR5)
    Samsung Now Producing Four Gigabit LPDDR3 Mobile DRAM, Using 20nm-class Process Technology
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Speed for the next generation of mobile devices
    NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    Samuti võite olla huvitatud
    • K4A4G085WE-BIRC

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      4 Gb 512M x 8 2400 Mbps 1.2 V -40 ~ 95 °C 78FBGA.

    • K4ABG165WA-MCWE

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      32 Gb 2G x 16 3200 Mbps 1.2 V 0 ~ 85 °C 96FBGA Sample.

    • K4A4G085WE-BITD

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      4 Gb 512M x 8 2666 Mbps 1.2 V -40 ~ 95 °C 78FBGA Mass Production.

    • K4A4G085WF-BCTD

      Samsung Semiconductor

      4 Gb 512M x 8 2666 Mbps 1.2 V 0 ~ 85 °C 78FBGA Mass Production.

    • K4A4G085WF-BITD

      Samsung Semiconductor

      4 Gb 512M x 8 2666 Mbps 1.2 V -40 ~ 95 °C 78FBGA Sample.

    • K4A4G165WE-BCWE

      Samsung Semiconductor

      4 Gb 256M x 16 3200 Mbps 1.2 V 0 ~ 85 °C 96FBGA Mass Production.

    Kuumad osad