Bergquist - SP600-05

KEY Part #: K6153041

SP600-05 Hinnakujundus (USD) [131719tk Laos]

  • 1 pcs$0.28080
  • 10 pcs$0.24996
  • 50 pcs$0.22417
  • 100 pcs$0.19830
  • 500 pcs$0.17244
  • 1,000 pcs$0.12933
  • 5,000 pcs$0.11208

Osa number:
SP600-05
Tootja:
Bergquist
Täpsem kirjeldus:
THERM PAD 41.91MMX28.96MM GREEN.
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termopadjad, lehed, Termilised - soojustorud, aurukambrid, Termilised - termoelektrilised, Peltieri sõlmed, Alalisvoolu ventilaatorid, Termilised - liimid, epoksidid, määrded, pastad, Termilised lisatarvikud, AC fännid and Termilised - jahutusradiaatorid ...
Konkurentsieelis:
We specialize in Bergquist SP600-05 electronic components. SP600-05 can be shipped within 24 hours after order. If you have any demands for SP600-05, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP600-05 Toote atribuudid

Osa number : SP600-05
Tootja : Bergquist
Kirjeldus : THERM PAD 41.91MMX28.96MM GREEN
Sari : Sil-Pad® 600
Osa olek : Active
Kasutamine : TO-3
Tüüp : Pad, Sheet
Kuju : Rhombus
Kontuur : 41.91mm x 28.96mm
Paksus : 0.0090" (0.229mm)
Materjal : Silicone Elastomer
Liim : -
Varundamine, kandja : -
Värv : Green
Soojuslik vastupidavus : 0.35°C/W
Soojusjuhtivus : 1.0 W/m-K

Samuti võite olla huvitatud
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-34

    Wakefield-Vette

    THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole