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  1. Kodu
  2. Tooted
  3. DRAM
  4. MODULE
  5. M393B1G73EB0-YK0

Samsung Semiconductor - M393B1G73EB0-YK0

KEY Part #: K7359924

[25454tk Laos]

    Osa number:
    M393B1G73EB0-YK0
    Tootja:
    Samsung Semiconductor
    Täpsem kirjeldus:
    DDR3 RDIMM 8 GB 2R x 8 1600 Mbps 1.5 V / 1.35 V 240 (512M x 8) x 18 Mass Production.
    Manufacturer's standard lead time:
    Laos
    Säilitusaeg:
    Üks aasta
    Chip From:
    Hongkong
    RoHS:
    Makseviis:
    Saadetise viis:
    Perekonna kategooriad:
    KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: HBM Aquabolt, SLC Nand, DDR3, GDDR5, LPDDR5, DDR4, LPDDR4X and HBM Flarebolt ...
    Konkurentsieelis:
    We specialize in Samsung Semiconductor M393B1G73EB0-YK0 electronic components. M393B1G73EB0-YK0 can be shipped within 24 hours after order. If you have any demands for M393B1G73EB0-YK0, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    M393B1G73EB0-YK0 Toote atribuudid

    Osa number : M393B1G73EB0-YK0
    Tootja : Samsung Semiconductor
    Kirjeldus : DDR3 RDIMM 8 GB 2R x 8 1600 Mbps 1.5 V / 1.35 V 240 (512M x 8) x 18 Mass Production
    Sari : DDR3
    DDR : DDR3
    tüüpi dIMM : RDIMM
    tihedus : 8 GB
    Koht x Org. : 2R x 8
    kiirus : 1600 Mbps
    Pinge : 1.5 V / 1.35 V
    Arv Pin : 240
    Component koosseis : (512M x 8) x 18
    toote staatus : Mass Production

    Viimased uudised

    5G and Memory - from Connected Thinking to Connected Living
    SSDs, DRAM and gaming: Unlocking a new level of performance
    High Bandwidth Memory is Catching on for Data-intensive Computing
    The future of NAND technology
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    Samsung wins 46 CES 2020 Innovation Awards for Outstanding Design and Engineering
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI
    Evolving Mobile Solutions: Samsung at MWC 2018
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
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