t-Global Technology - DC0011/10-TI900-0.12

KEY Part #: K6153074

DC0011/10-TI900-0.12 Hinnakujundus (USD) [283397tk Laos]

  • 1 pcs$0.13051
  • 10 pcs$0.12577
  • 25 pcs$0.11960
  • 50 pcs$0.11644
  • 100 pcs$0.11485
  • 250 pcs$0.10699
  • 500 pcs$0.10069
  • 1,000 pcs$0.09125
  • 5,000 pcs$0.08811

Osa number:
DC0011/10-TI900-0.12
Tootja:
t-Global Technology
Täpsem kirjeldus:
THERM PAD 19.05MMX12.7MM WHITE.
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termiline - vedelikjahutus, Alalisvoolu ventilaatorid, Ventilaatorid - tarvikud, Termopadjad, lehed, Termilised - termoelektrilised, Peltieri moodulid, Ventilaatorid - Lisatarvikud - Ventilaatori nöörid, AC fännid and Termilised - jahutusradiaatorid ...
Konkurentsieelis:
We specialize in t-Global Technology DC0011/10-TI900-0.12 electronic components. DC0011/10-TI900-0.12 can be shipped within 24 hours after order. If you have any demands for DC0011/10-TI900-0.12, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DC0011/10-TI900-0.12 Toote atribuudid

Osa number : DC0011/10-TI900-0.12
Tootja : t-Global Technology
Kirjeldus : THERM PAD 19.05MMX12.7MM WHITE
Sari : Ti900
Osa olek : Active
Kasutamine : TO-220
Tüüp : Die-Cut Pad, Sheet
Kuju : Rectangular
Kontuur : 19.05mm x 12.70mm
Paksus : 0.0050" (0.127mm)
Materjal : Silicone
Liim : -
Varundamine, kandja : Viscose
Värv : White
Soojuslik vastupidavus : -
Soojusjuhtivus : 1.8 W/m-K

Samuti võite olla huvitatud
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick