[8725tk Laos]
- Osa number:
- APF19-19-13CB
- Tootja:
- CTS Thermal Management Products
- Täpsem kirjeldus:
- HEATSINK LOW-PROFILE FORGED.
- Manufacturer's standard lead time:
- Laos
- Säilitusaeg:
- Üks aasta
- Chip From:
- Hongkong
- RoHS:
- Makseviis:
-
- Saadetise viis:
- Perekonna kategooriad:
- KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termiline - vedelikjahutus, Termopadjad, lehed, Termilised - liimid, epoksidid, määrded, pastad, Alalisvoolu ventilaatorid, Termilised lisatarvikud, Termilised - liimid, epoksidid, määrded, pastad, AC fännid and Ventilaatorid - tarvikud ...
- Konkurentsieelis:
- We specialize in CTS Thermal Management Products APF19-19-13CB electronic components. APF19-19-13CB can be shipped within 24 hours after order. If you have any demands for APF19-19-13CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
APF19-19-13CB Toote atribuudid
Osa number :
APF19-19-13CB
Tootja :
CTS Thermal Management Products
Kirjeldus :
HEATSINK LOW-PROFILE FORGED
Sari :
APF
Osa olek :
Active
Tüüp :
Top Mount
Pakend jahutatud :
Assorted (BGA, LGA, CPU, ASIC...)
Kinnitusviis :
Thermal Tape, Adhesive (Not Included)
Kuju :
Square, Fins
Pikkus :
0.748" (19.00mm)
Laius :
0.748" (19.00mm)
Läbimõõt :
-
Kõrgus väljaspool alust (fini kõrgus) :
0.500" (12.70mm)
Toite hajumine @ temperatuuri tõus :
-
Termiline vastupidavus @ sunnitud õhuvool :
4.00°C/W @ 200 LFM
Soojuskindlus @ looduslik :
-
Materjal :
Aluminum
Materjali viimistlus :
Black Anodized
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