Advanced Thermal Solutions Inc. - ATS-H1-20-C2-R0

KEY Part #: K6263961

ATS-H1-20-C2-R0 Hinnakujundus (USD) [8517tk Laos]

  • 1 pcs$4.54362
  • 10 pcs$4.42242
  • 25 pcs$4.17695
  • 50 pcs$3.93122
  • 100 pcs$3.68549
  • 250 pcs$3.43979
  • 500 pcs$3.19409
  • 1,000 pcs$3.13266

Osa number:
ATS-H1-20-C2-R0
Tootja:
Advanced Thermal Solutions Inc.
Täpsem kirjeldus:
HEATSINK 54X54X25MM XCUT T766.
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termilised - jahutusradiaatorid, Termilised - termoelektrilised, Peltieri moodulid, Termilised - liimid, epoksidid, määrded, pastad, Termiline - vedelikjahutus, Termilised - liimid, epoksidid, määrded, pastad, Termilised lisatarvikud, Termilised - termoelektrilised, Peltieri sõlmed and AC fännid ...
Konkurentsieelis:
We specialize in Advanced Thermal Solutions Inc. ATS-H1-20-C2-R0 electronic components. ATS-H1-20-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-20-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-H1-20-C2-R0 Toote atribuudid

Osa number : ATS-H1-20-C2-R0
Tootja : Advanced Thermal Solutions Inc.
Kirjeldus : HEATSINK 54X54X25MM XCUT T766
Sari : pushPIN™
Osa olek : Active
Tüüp : Top Mount
Pakend jahutatud : Assorted (BGA, LGA, CPU, ASIC...)
Kinnitusviis : Push Pin
Kuju : Square, Fins
Pikkus : 2.126" (54.01mm)
Laius : 2.126" (54.00mm)
Läbimõõt : -
Kõrgus väljaspool alust (fini kõrgus) : 0.984" (25.00mm)
Toite hajumine @ temperatuuri tõus : -
Termiline vastupidavus @ sunnitud õhuvool : 7.14°C/W @ 100 LFM
Soojuskindlus @ looduslik : -
Materjal : Aluminum
Materjali viimistlus : Blue Anodized

Samuti võite olla huvitatud
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-2AB

    Wakefield-Vette

    HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-32-32-6-PF

    t-Global Technology

    HEATSINK CER 32X32X6MM W/TAPE.