t-Global Technology - TG6050-20-10-1

KEY Part #: K6153090

TG6050-20-10-1 Hinnakujundus (USD) [110024tk Laos]

  • 1 pcs$0.33618
  • 10 pcs$0.32075
  • 25 pcs$0.30485
  • 50 pcs$0.29678
  • 100 pcs$0.29275
  • 250 pcs$0.27271
  • 500 pcs$0.25666
  • 1,000 pcs$0.23260
  • 5,000 pcs$0.22458

Osa number:
TG6050-20-10-1
Tootja:
t-Global Technology
Täpsem kirjeldus:
THERM PAD 20MMX10MM RED.
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: AC fännid, Termilised - soojustorud, aurukambrid, Termiline - vedelikjahutus, Termilised - termoelektrilised, Peltieri sõlmed, Ventilaatorid - Lisatarvikud - Ventilaatori nöörid, Termopadjad, lehed, Termilised - termoelektrilised, Peltieri moodulid and Termilised - jahutusradiaatorid ...
Konkurentsieelis:
We specialize in t-Global Technology TG6050-20-10-1 electronic components. TG6050-20-10-1 can be shipped within 24 hours after order. If you have any demands for TG6050-20-10-1, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TG6050-20-10-1 Toote atribuudid

Osa number : TG6050-20-10-1
Tootja : t-Global Technology
Kirjeldus : THERM PAD 20MMX10MM RED
Sari : TG6050
Osa olek : Active
Kasutamine : -
Tüüp : Conductive Pad, Sheet
Kuju : Rectangular
Kontuur : 20.00mm x 10.00mm
Paksus : 0.0400" (1.016mm)
Materjal : Silicone Elastomer
Liim : Tacky - Both Sides
Varundamine, kandja : -
Värv : Red
Soojuslik vastupidavus : -
Soojusjuhtivus : 6.0 W/m-K

Samuti võite olla huvitatud
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick