Advanced Thermal Solutions Inc. - ATS-X50230G-C1-R0

KEY Part #: K6263924

ATS-X50230G-C1-R0 Hinnakujundus (USD) [5343tk Laos]

  • 1 pcs$7.65055
  • 10 pcs$7.22616
  • 25 pcs$6.80123
  • 50 pcs$6.37614

Osa number:
ATS-X50230G-C1-R0
Tootja:
Advanced Thermal Solutions Inc.
Täpsem kirjeldus:
SUPERGRIP HEATSINK 23X23X12.5MM. Heat Sinks maxiFLOW superGRIP BGA Heatsink, T766, Blue-Anodized, 22.25x22.25x12.5mm
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termilised - liimid, epoksidid, määrded, pastad, Termilised - termoelektrilised, Peltieri sõlmed, Termilised - soojustorud, aurukambrid, Termilised lisatarvikud, Termiline - vedelikjahutus, Ventilaatorid - tarvikud, AC fännid and Ventilaatorid - Lisatarvikud - Ventilaatori nöörid ...
Konkurentsieelis:
We specialize in Advanced Thermal Solutions Inc. ATS-X50230G-C1-R0 electronic components. ATS-X50230G-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X50230G-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X50230G-C1-R0 Toote atribuudid

Osa number : ATS-X50230G-C1-R0
Tootja : Advanced Thermal Solutions Inc.
Kirjeldus : SUPERGRIP HEATSINK 23X23X12.5MM
Sari : maxiFLOW, superGRIP™
Osa olek : Active
Tüüp : Top Mount
Pakend jahutatud : BGA
Kinnitusviis : Clip, Thermal Material
Kuju : Square, Angled Fins
Pikkus : 0.900" (23.00mm)
Laius : 0.906" (23.01mm)
Läbimõõt : -
Kõrgus väljaspool alust (fini kõrgus) : 0.492" (12.50mm)
Toite hajumine @ temperatuuri tõus : -
Termiline vastupidavus @ sunnitud õhuvool : 6.70°C/W @ 200 LFM
Soojuskindlus @ looduslik : -
Materjal : Aluminum
Materjali viimistlus : Blue Anodized

Samuti võite olla huvitatud
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.