Bergquist - HIFLOW-105-AC-1.8X.74

KEY Part #: K6153043

HIFLOW-105-AC-1.8X.74 Hinnakujundus (USD) [79254tk Laos]

  • 1 pcs$0.49336
  • 10 pcs$0.44026
  • 50 pcs$0.39460
  • 100 pcs$0.33020

Osa number:
HIFLOW-105-AC-1.8X.74
Tootja:
Bergquist
Täpsem kirjeldus:
HI-FLOW 0.74X1.8.
Manufacturer's standard lead time:
Laos
Säilitusaeg:
Üks aasta
Chip From:
Hongkong
RoHS:
Makseviis:
Saadetise viis:
Perekonna kategooriad:
KEY Components Co, Ltd on elektrooniliste komponentide turustaja, kes pakub tootekategooriaid, sealhulgas: Termilised - termoelektrilised, Peltieri moodulid, Termilised - jahutusradiaatorid, Termilised - termoelektrilised, Peltieri sõlmed, Termilised lisatarvikud, Termopadjad, lehed, AC fännid, Termilised - liimid, epoksidid, määrded, pastad and Termiline - vedelikjahutus ...
Konkurentsieelis:
We specialize in Bergquist HIFLOW-105-AC-1.8X.74 electronic components. HIFLOW-105-AC-1.8X.74 can be shipped within 24 hours after order. If you have any demands for HIFLOW-105-AC-1.8X.74, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HIFLOW-105-AC-1.8X.74 Toote atribuudid

Osa number : HIFLOW-105-AC-1.8X.74
Tootja : Bergquist
Kirjeldus : HI-FLOW 0.74X1.8
Sari : -
Osa olek : Active
Kasutamine : -
Tüüp : -
Kuju : -
Kontuur : -
Paksus : -
Materjal : -
Liim : -
Varundamine, kandja : -
Värv : -
Soojuslik vastupidavus : -
Soojusjuhtivus : -

Samuti võite olla huvitatud
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-34

    Wakefield-Vette

    THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole