Termopadjad, lehed

Pilt KEY osa nr / tootja Kirjeldus / PDF Kogus / RFQ
PL-2-1-1016

PL-2-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Grey

14634tk Laos

PL-1-3-254

PL-1-3-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Green

32248tk Laos

PL-05-1-1016

PL-05-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Grey

18445tk Laos

PL-05-5-254

PL-05-5-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold

32699tk Laos

CD-02-05-C-54

CD-02-05-C-54

Wakefield-Vette

THERM PAD 2.106 X 2.106. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 2.106 Inch x 2.106 Inch, No Hole

55666tk Laos

PL-2-5-254

PL-2-5-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold

25276tk Laos

CD-02-05-218

CD-02-05-218

Wakefield-Vette

THERM PAD TO-218 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-218 Pad with Hole

190859tk Laos

CD-02-05-C-39

Wakefield-Vette

THERM PAD 1.516 X 1.516. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.516 Inch x 1.516 Inch, No Hole

87402tk Laos

PL-05-3-254

PL-05-3-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Green

34131tk Laos

PL-05-3-1016

PL-05-3-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Green

16790tk Laos

PL-2-3-1016

PL-2-3-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Green

10425tk Laos

PL-2-5-1016

PL-2-5-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold

7677tk Laos

PL-1-3-254-H

PL-1-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft

32248tk Laos

CD-02-05-C-46

CD-02-05-C-46

Wakefield-Vette

THERM PAD 1.811 X 1.811. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.811 Inch x 1.811 Inch, No Hole

77289tk Laos

PL-2-3-254-H

PL-2-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft

29225tk Laos

PL-05-3-254-H

PL-05-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold, Hyper Soft

34131tk Laos

PL-05-5-1016

PL-05-5-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Gold

14454tk Laos

CD-02-05-C-34

CD-02-05-C-34

Wakefield-Vette

THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole

112675tk Laos

CD-02-05-C-49

Wakefield-Vette

THERM PAD 1.909 X 1.909. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.909 Inch x 1.909 Inch, No Hole

61527tk Laos

PL-2-5-1016-H

PL-2-5-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold, Hyper Soft

7392tk Laos