Pilt | KEY osa nr / tootja | Kirjeldus / PDF | Kogus / RFQ |
---|---|---|---|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Grey |
14634tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Green |
32248tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Grey |
18445tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold |
32699tk Laos |
|
Wakefield-Vette |
THERM PAD 2.106 X 2.106. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 2.106 Inch x 2.106 Inch, No Hole |
55666tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold |
25276tk Laos |
|
Wakefield-Vette |
THERM PAD TO-218 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-218 Pad with Hole |
190859tk Laos |
|
Wakefield-Vette |
THERM PAD 1.516 X 1.516. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.516 Inch x 1.516 Inch, No Hole |
87402tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Green |
34131tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Green |
16790tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Green |
10425tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold |
7677tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
32248tk Laos |
|
Wakefield-Vette |
THERM PAD 1.811 X 1.811. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.811 Inch x 1.811 Inch, No Hole |
77289tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
29225tk Laos |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold, Hyper Soft |
34131tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Gold |
14454tk Laos |
|
Wakefield-Vette |
THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole |
112675tk Laos |
|
Wakefield-Vette |
THERM PAD 1.909 X 1.909. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.909 Inch x 1.909 Inch, No Hole |
61527tk Laos |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 101.6x1016mm, Gold, Hyper Soft |
7392tk Laos |