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321127B00000

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK.

21758tk Laos

2286BG

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Extruded Heatsink, Radial Fin, Square, 0.79x0.155 Inch

11128tk Laos

6084BG

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 8.38x13.21x19.05mm

81884tk Laos

6263B-MT5G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks High-Rise Style Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, Black Anodized, 10.16x44.45x44.7mm

44944tk Laos

2207/PR11B ASSY

Aavid, Thermal Division of Boyd Corporation

HEAT SINK.

3163tk Laos

7025BG

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Channel Style Heatsink for TO-220, Folded Back Fins, Vertical Mounting, 6.8 n Thermal Resistance, No Solderable tabs, 2.90mm Hole

141875tk Laos

6273BG

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Board Level Stamped Heatsink for TO-202, Vertical Mounting, 9.52x19.05x19.05mm

71827tk Laos

2283B

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK.

6911tk Laos

341600F00000G

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm

36131tk Laos

6381BG

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Heatsink for MULTIWATT, Vertical Mounting, 5.8 n Thermal Resistance, Black Anodized, 2.89mm Hole, 38.1mm, Solderable Pins

38264tk Laos

326005R00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink for TO-5, Vertical Mounting, 12.7x12.7x9.52mm

54891tk Laos

2207/PR11B ASSYG

Aavid, Thermal Division of Boyd Corporation

HEATSINK.

2070tk Laos

335714B00000G

Aavid, Thermal Division of Boyd Corporation

HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 30x30x7mm, IC Pkg Size = 30 x 30, Epoxy

103241tk Laos

322805B00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Vertical Mounting, 22.23x22.23x13.49mm

39987tk Laos

342000F00000G

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm

23471tk Laos

115600F00000G

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Rail Mounting Heatsink Clip, Stainless Steel

473765tk Laos

1130BG

Aavid, Thermal Division of Boyd Corporation

HEATSINK. Heat Sinks Thermal Link with BeO Insulator for TO-5, Vertical Mounting, Black Anodized, 15 n Thermal Resistance

9207tk Laos

325705R00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height

54530tk Laos

6000DG

Aavid, Thermal Division of Boyd Corporation

HEAT SINK. Heat Sinks Stamped Heatsink for Axial Lead Devices, Vertical Mounting, Copper, 15 n Thermal Resistance, Tin Plated

46895tk Laos

335214B00000G

Aavid, Thermal Division of Boyd Corporation

HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 25x25x10mm, IC Pkg Size = 25 x 25, Epoxy

73229tk Laos