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HEATSINK 35X35X10MM R-TAB CP.

HEAT SINK 35MM X 35MM X 19.5MM. Heat Sinks BGA Heatsink, High Performance, Double-Sided Thermal Tape, Black-Anodized, 35x35x19.5mm

HEATSINK TI TAS5612 AND TAS5614. Heat Sinks Heatsink for TI Module TAS5612/TAS5614, Black-Anodized, 78x36x35.6mm

HEATSINK 57.9X60.96X22.86MM FP.

HEATSINK 40X40X10MM L-TAB CP.

HEATSINK TO-247 TO-264 TO-220.

HEATSINK TO-220 4.1W ALUMINUM. Heat Sinks 19 x 22 x 11.2mm TO-220 solder pin

HEATSINK TO-247 TO-264 TO-220.

HEATSINK LOW-PROFILE FORGED. Heat Sinks 19x19x6mm Heat Sink

HEAT SINK 17MM X 17MM X 9.5MM. Heat Sinks BGA Heatsink, High Performance X-CUT, Square Fins, Double-Sided Thermal Tape, Black-Anodized, 17x17x9.5mm

HEATSINK CPU W/ADHESIVE 1.21SQ.

HEATSINK DC/DC HALF BRICK VERT.

ALUMINUM HEATSINK 50MM BLK ANODI. Heat Sinks Aluminum heatsink 50mmBlkAnodized

HEATSINK FOR TO-247 WITH 3 CLIPS. Heat Sinks HEATSINK FOR TO-247 3 CLIPS, RADIAL

HEAT SINK 23MM X 23MM X 7.5MM. Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, T766, Blue-Anodized, 23x23x7.5mm

HEATSINK 19X19X23MM PIN. Heat Sinks Chipset Heatsink with Clip, Pin Fin, 19mm Chip Size, 22.6mm Height, Aluminum, Black Anodized

HEAT SINK 35MM X 35MM X 24.5MM. Heat Sinks BGA Heatsink, High Performance Extrusion, Square Fins, Double-Sided Thermal Tape, Black-Anodized, 35x35x24.5mm

1/4 BRICK HEATSINK 37X58X22.9MM. Heat Sinks maxiFLOW Power Brick Heatsink, Quarter Brick, Gold-Anodized, T766, Hardware, 37x58x22.9mm, 58mm dia.

HEATSINK ALUM ANOD.

MAXIGRIP FANSINK 40X40X19.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, T412, Black-Anodized, 39.25x39.25x19.5mm, 39.25mm dia.