eMMC, KLM8G1GESD-B03P, KLM8G1GESD-B03Q, 0

KEY osa nr / tootja	Kirjeldus / PDF	Kogus / RFQ
KLM4G1FETE-B041 Samsung Semiconductor	eMMC 5.1 4 GB 1.8, 3.3 V / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C Mass Production.	15482tk Laos
KLM8G1GESD-B03P Samsung Semiconductor	eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	22853tk Laos
KLM8G1GESD-B03Q Samsung Semiconductor	eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	14400tk Laos
KLM8G1GESD-B04P Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	15632tk Laos
KLM8G1GESD-B04Q Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	20904tk Laos
KLM8G1GETF-B041 Samsung Semiconductor	eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	17324tk Laos
KLM8G1GEUF-B04P Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	22980tk Laos
KLM8G1GEUF-B04Q Samsung Semiconductor	eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	22628tk Laos
KLMAG1JETD-B041 Samsung Semiconductor	eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	17024tk Laos
KLMAG2GESD-B03P Samsung Semiconductor	eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	16293tk Laos
KLMAG2GESD-B03Q Samsung Semiconductor	eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	16354tk Laos
KLMAG2GESD-B04P Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	18823tk Laos
KLMAG2GESD-B04Q Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	17877tk Laos
KLMAG2GEUF-B04P Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production.	18865tk Laos
KLMAG2GEUF-B04Q Samsung Semiconductor	eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production.	26635tk Laos
KLMBG2JETD-B041 Samsung Semiconductor	eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production.	23162tk Laos
KLMBG4GESD-B03P Samsung Semiconductor	eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	21846tk Laos
KLMBG4GESD-B03Q Samsung Semiconductor	eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production.	25702tk Laos
KLMBG4GESD-B04P Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	22661tk Laos
KLMBG4GESD-B04Q Samsung Semiconductor	eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production.	22160tk Laos

eMMC

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